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TITLE
DEDICATION
CERTIFICATE
DECLARATION
ACKNOWLEDGEMENT
ABSTRACT
PREFACE
CONTENTS
LIST OF FIGURES
LIST OF TABLES
1. A REVIEW OF ELECTRICAL, OPTICAL, STRUCTURAL AND TOPOLOGICAL STUDIES IN CUPC, NIPC AND COPC THIN FILMS
1.1 INTRODUCTION
1.2 ORGANIC SEMICONDUCTORS
Table 1.1: Comparison of the electrical properties of the inorganicsemiconductor germanium and organic semiconductor CuPc
1.3. Molecular Structure
Fig.1.1 Basic structural unit of a phthalocyanine molecule
Fig.1.2 Unit cell of a base centered phthalocyanine molecule.
Fig.1.3. Normal projections of two molecules of metal substituted phthalocyanine
1.4. Studies on Phthalocyanine Thin Films
A Electrical Studies
B. Optical Studies
C. Structural Studies
D. Topological Studies
References
2. APPARATUS AND EXPERIMENTAL TECHNIQUES USED IN THE PRESENT STUDY
2.1 Introduction
2.2 Methods of Preparation of Thin Films
2.2. 1 Thermal Evaporation Technique
2.2.1.1 Effect of Residual Gases
Table 2.1 Data on the residual air at 298K in a typical vacuum used for film deposition
2.2.1.2 Effect of Vapour Beam Intensity
2.2.1.3 Effect of Substrate Surface
2.2.1.4 Effect of Evaporation Rate
2.2.1.5 Contamination from Vapour source
2.2.1.6 Purity of the Evaporating Materials
2.2.1.7 Production of Vacuum
Oil Sealed Rotary Pump
Fig.2.1 Schematic diagram of the cross section of oil sealed rotary pump.
Diffusion pump
Fig.2.2: Schematic diagram of the cross section of a diffusion pump
2.2.2 Vacuum coating unit
Fig.2.3: Schematic diagram of a vacuum coating unit
Fig.2.4: Schematic representation of Pirani guage
Fig.2.5. Schematic representation of penning gauge
Fig.2.6: Photograph of “Hind Hivac” coating unit (Model No. 12 A4)
2.2.3 Substrate Cleaning
2.2.4 Substrate Heater
2.2.5 Preparation of films
2.3 Sample annealing
Fig.2.7. Block diagram of the temperature controller cum recorder
Fig.2.8: Photograph of annealing unit
2.4 Thickness Measurement
2.4.1 Tolansky’s Multiple Beam Interference Technique
Fig.2.9. Schematic representation of the multiple beam interference
2.5 Conductivity Cell
Fig.2.10. Schematic diagram of the cross section of the conductivity cell
2.6 Keithley Programmable Electrometer 617
Fig.2.11. Schematic diagram of measuring resistance on Keithley usingohms function.
Fig.2.12: Schematic diagram of measuring resistance on Keithley usingV/I function
Fig.2.13: Schematic diagram of electrical conductivity measurement (all dimensions are in mm)
Fig.2.14. Photograph of the electrical conductivity experimental set up
2.7 UV-Visible Spectrophotometer
Fig.2.15: Block diagram of the optical system of the Spectrophotometer (Shimadzu 160A)
Fig.2.16: Block diagram of the electrical system of the spectrophotometer (Shimadzu 160A)
Fig.2.17 Photograph of the spectrophotometer
2.8 X-ray Diffractometer
Fig.2.18 Block diagram of BRUKER D5005 diffractometer
Fig.2.19 Photograph of the BRUKER D5005 diffractometer
2.9 Scanning Electron Microscopy (SEM)
Fig.2.20 Interaction between incident electrons and specimen
Fig.2.21 Secondary electron detector
Fig.2.22 Edge effect, secondary electron emission differing withsurface condition
2.9.1 Influence of charge-up on image quality
2.9.2 Specimen damage by electron beam
2.9.3 Backscattered electrons
Fig.2.23: back scattered electron detector
2.9.4 Resolution of the SEM
Fig.2.24: Photograph of LEO 435VP Scanning Electron Microscope.
2.9.5 Energy Dispersive X-ray Analysis (EDAX)
Reference
3. ELECTRICAL STUDIES ON COPPER PHTHALOCYANINE, NICKEL PHTHALOCYANINE AND COBALT PHTHALOCYANINE THIN FILMS
3.1 Introduction
3.2 Theory
3.3 Experiment
3.4 Results and Discussion
3.4.1 Dependence of film thickness
Fig.3.4.1: ln σ versus 1000/T plot of CuPc thin film of thickness 180nm
Fig.3.4.2: ln σ versus 1000/T plot of CuPc thin film of thickness 301nm
Fig.3.4.3: ln σ versus 1000/T plot of CuPc thin film of thickness 467nm
Table 3.4.1: Variation of activation energy for CuPc thin films with different thickness
Fig.3.4.4: ln σ versus 1000/T plot of NiPc thin film of thickness 94nm
Fig.3.4.5: ln σ versus 1000/T plot of NiPc thin film of thickness 132nm
Fig.3.4.6: ln σ versus 1000/T plot of NiPc thin film of thickness 156nm
Fig.3.4.7: ln σ versus 1000/T plot of NiPc thin film of thickness 194nm
Table 3.4.2: Variation of activation energy for NiPc thin films with different thickness
Fig.3.4.8: ln σ versus 1000/T plot of CoPc thin film of thickness 181nm
Fig.3.4.9: ln σ versus 1000/T plot of CoPc thin film of thickness 301nm
Fig.3.4.10: ln σ versus 1000/T plot of CoPc thin film of thickness 405nm
Table 3.4.3: Variation of activation energy for CoPc thin films with different thicknesses
3.4.2 Dependence of substrate temperature
Fig.3.4.11: ln σ versus 1000/T plot of CuPc thin film prepared at substrate temperature 318K.
Fig.3.4.12: ln σ versus 1000/T plot of CuPc thin film prepared at substrate temperature 363K.
Fig.3.4.13: ln σ versus 1000/T plot of CuPc thin film prepared at substrate temperature 408K.
Fig.3.4.14: ln σ versus 1000/T plot of CuPc thin film prepared at substrate temperature 458K.
Table 3.4.4: Variation of activation energy for CuPc thin films with different substrate temperatures
Fig.3.4.15: ln σ versus 1000/T plot of NiPc thin film prepared at substrate temperature 318K.
Fig.3.4.16: ln σ versus 1000/T plot of NiPc thin film prepared at substrate temperature 363K.
Fig.3.4.17: In σ versus 1000/T plot of NiPc thin film prepared at substrate temperature 408K.
Fig.3.4.18: ln σ versus 1000/T plot of NiPc thin film prepared at substrate temperature 458K.
Table 3.4.5: Variation of activation energy for NiPc thin films with different substrate temperatures.
Fig.3.4.19: ln σ versus 1000/T plot of CoPc thin film prepared at substrate temperature 318K.
Fig.3.4.20: ln σ versus 1000/T plot of CoPc thin film prepared at substrate temperature 363K.
Fig.3.4.21: ln σ versus 1000/T plot of CoPc thin film prepared at substrate temperature 408K.
Fig.3.4.22: ln σ versus 1000/T plot of CoPc thin film prepared at substrate temperature 458K.
Table 3.4.6: Variation of activation energy for CoPc thin films with different substrate temperatures
3.4.3 Dependence of air - annealing
Fig. 3.4.23: ln σ versus 1000/T plot of CuPc thin film annealed 313K
Fig.3.4.24: ln σ versus 1000/T plot of CuPc thin film annealed 353K
Fig.3.4.25: ln σ versus 1000/T plot of CuPc thin film annealed 393K
Fig.3.4.26: ln σ versus 1000/T plot of CuPc thin film annealed 433K
Table 3.4.7: Variation of activation energy for CuPc thin films with different annealing temperature
Fig.3.4.27: ln σ versus 1000/T plot of NiPc thin film annealed at 313K
Fig.3.4.28: ln σ versus 1000/T plot of NiPc thin film annealed at 353K
Fig.3.4.29: ln σ versus 1000/T plot of NiPc thin film annealed at 393K
Fig.3.4.30: ln σ versus 1000/T plot of NiPc thin film annealed at 433K
Table 3.4.8: Variation of activation energy for NiPc thin films with different annealing temperatures
Fig.3.4.31: ln σ versus 1000/T plot of CoPc thin film annealed at 313K.
Fig.3.4.32: ln σ versus 1000/T plot of CoPc thin film annealed at 353K.
Fig.3.4.33: ln σ versus 1000/T plot of CoPc thin film annealed at 393K.
Fig.3.4.34: ln σ versus 1000/T plot of CoPc thin film annealed at 433K.
Table 3.4.9: Variation of activation energy for CoPc thin films with different annealing temperatures
CONCLUSION
References
4. OPTICAL STUDIES IN COPPER PHTHALOCYANINE, NICKEL PHTHALOCYANINE AND COBALT PHTHALOCYANINE THIN FILMS
4.1. Introduction
Fig.4.1.1: The schematic diagram of energy levels in metalphthalocyanine and the various allowed transitions
4.2. Theory
Fig.4.2.1 Schematic diagram showing direct transition from valenceband to conduction band
Fig.4.2.2: Schematic diagram showing indirect transition from valenceband to conduction band
Fig.4.2.3: Illustration of Burstein-Moss shift.
4.3. Experiment
4.4 Results and Discussion
4.4.1 Dependence of film thickness
Fig.4.4.1: Absorbance versus wavelength spectrum of CuPc thin filmof thickness 180nm.
Fig.4.4.2: Plot of a2 versus h for CuPc thin film of thickness 180nm
Fig.4.4.3: Plot of a2 versus h for CuPc thin film of thickness 180nm (trap level)
Fig.4.4.4: Plot of a2 versus h for CuPc thin film of thickness 180nm (trap level)
Fig.4.4.5 Absorbance versus wavelength plot of CuPc thin film ofthickness 220nm
Fig.4.4.6: Plot of a2 versus h for CuPc thin film of thickness 220nm
Fig.4.4.7 Plot of a2 versus h for CuPc thin film of thickness 220nm (trap level)
Fig.4.4.8: Plot of a2 versus h for CuPc thin film of thickness 220nm (trap level)
Fig.4.4.9 Absorbance versus wavelength plot of CuPc thin film ofthickness 360nm
Fig.4.4.10: Plot of a2 versus h for CuPc thin film of thickness 360nm
Fig.4.4.11: Plot of a2 versus h for CuPc thin film of thickness 360nm (trap level)
Fig. 4.4.12: Plot of a2 versus h for CuPc thin film of thickness 360nm (trap level)
Fig.4.4.13: Absorbance versus wavelength plot of CuPc thin film ofthickness 400nm
Fig. 4.4.14 Plot of a2 versus h for CuPc thin film of thickness 400nm
Fig.4.4.15 Plot of a2 versus h for CuPc thin film of thickness 400nm (trap level)
Fig.4.4.16 Plot of a2 versus h for CuPc thin film of thickness 400nm (trap level)
Table4.4.1 The optical band gap energies of CuPc thin films of differentthicknesses
Fig.4.4.17 Absorbance versus wavelength plot of NiPc thin film ofthickness 94nm.
Fig.4.4.18 Plot of a2 versus h for NiPc thin film of thickness 94nm
Fig.4.4.19 Plot of a2 versus h for NiPc thin film of thickness 94nm (trap level)
Fig.4.4.20 Plot of a2 versus h for NiPc thin film of thickness 94nm (trap level)
Fig.4.4.21 Absorbance versus wavelength spectrum of NiPc thin filmof thickness 133nm
Fig.4.4.22 Plot of a2 versus h for NiPc thin film of thickness 133nm
Fig.4.4.23 Plot of a2 versus h for NiPc thin film of thickness 133nm (trap level)
Fig.4.4.24 Plot of a2 versus h for NiPc thin film of thickness 133nm (trap level)
Fig.4.4.25 Absorbance versus wavelength plot of NiPc thin film ofthickness 156nm
Fig.4.4.26 Plot of a2 versus h for NiPc thin film of thickness 156nm
Fig.4.4.27 Plot of a2 versus h for NiPc thin film of thickness 156nm (trap level)
Fig.4.4.28 Plot of a2 versus h for NiPc thin film of thickness 156nm (trap level)
Fig.4.4.29 Absorbance versus wavelength plot of NiPc thin film ofthickness 195nm
Fig. 4.4.30 Plot of a2 versus h for NiPc thin film of thickness 195nm
Fig.4.4.31 Plot of a2 versus h for NiPc thin film of thickness 195nm (trap level)
Fig.4.4.32 Plot of a2 versus h for NiPc thin film of thickness 195nm (trap level)
Table 4.4.2 The optical band gap energies of NiPc thin films of differentthickness
Fig.4.4.33 Absorbance versus wavelength plot of CoPc thin film ofthickness 297nm
Fig.4.4.34 Plot of a2 versus h for CoPc thin film of thickness 297nm
Fig.4.4.35 Plot of a2 versus h for CoPc thin film of thickness 297 nm (trap level)
Fig.4.4.36 Plot of a2 versus h for CoPc thin film of thickness297nm (trap level)
Fig.4.4.37 Absorbance versus wavelength plot of CoPc thin film ofthickness 425nm
Fig.4.4.38 Plot of a2 versus h for CoPc thin film of thickness 425nm
Fig.4.4.39 Plot of a2 versus h for CoPc thin film of thickness425nm (trap level)
Fig.4.4.40 Plot of a2 versus h for CoPc thin film of thickness425nm (trap level)
Fig.4.4.41 Absorbance versus wavelength plot of CoPc thin film ofthickness 443nm.
Fig.4.4.42 Plot of a2 versus h for CoPc thin film of thickness 443nm
Fig.4.4.43 Plot of a2 versus h for CoPc thin film of thickness443nm (trap level)
Fig.4.4.44 Plot of a2 versus h for CoPc thin film of thickness 443nm (trap level)
Table 4.4.3 The optical band gap energies of CoPc thin films of differentthickness
4.4.2 Dependence of substrate temperature
Fig.4.4.45 Absorbance versus wavelength plot of CuPc thin filmprepared at substrate temperature 318K.
Fig.4.4.46 Plot of a2 versus h for CuPc thin film prepared at substratetemperature 318K.
Fig.4.4.47: Plot of a2 versus h for CuPc thin film prepared at substratetemperature 318K (trap level)
Fig.4.4.48 Absorbance versus wavelength plot of CuPc thin filmprepared at substrate temperature 363K.
Fig.4.4.49: Plot of a2 versus h for CuPc thin film prepared atsubstrate temperature 363K.
Fig.4.4.50 Plot of a2 versus h for CuPc thin film prepared at substratetemperature 363K (trap level)
Fig.4.4.51 Absorbance versus wavelength plot of CuPc thin filmprepared at substrate temperature 408K.
Fig.4.4.52 Plot of a2 versus h for CuPc thin film prepared at substratetemperature 408
Fig.4.4.53 Plot of a2 versus h for CuPc thin film prepared atsubstrate temperature 408K (trap level)
Fig.4.4.54: Absorbance versus wavelength plot of CuPc thin filmprepared at substrate temperature 458K.
Fig.4.4.55: Plot of a2 versus h for CuPc thin film prepared at substratetemperature 458K.
Fig.4.4.56: Plot of a2 versus h for CuPc thin film prepared at substratetemperature 458K (trap level)
Fig.4.4.57: Plot of a2 versus h for CuPc thin film prepared at substratetemperature 458K (trap level)
Table 4.4.4 The optical band gap energies of CuPc thin films deposited atdifferent substrate temperatures.
Fig.4.4.58 Absorbance versus wavelength plot of NiPc thin filmprepared at substrate temperature 318K.
Fig.4.4.59 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 318K.
Fig.4.4.60 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 318K (trap level)
Fig.4.4.61 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 318K (trap level)
Fig.4.4.62 Absorbance versus wavelength plot of NiPc thin filmprepared at substrate temperature 363K.
Fig.4.4.63 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 363K.
Fig.4.4.64 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 363K (trap level)
Fig.4.4.65 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 363K (trap level)
Fig.4.4.66 Absorbance versus wavelength plot of NiPc thin filmprepared at substrate temperature 408K
Fig.4.4.67 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 408K.
Fig.4.4.68 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 408K (trap level)
Fig.4.4.69 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 408K (trap level)
Fig.4.4.70 Absorbance versus wavelength plot of NiPc thin filmprepared at temperature 458K.
Fig.4.4.71 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 458K.
Fig.4.4.72 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 458K (trap level)
Fig.4.4.73 Plot of a2 versus h for NiPc thin film prepared at substratetemperature 458K (trap level)
Table 4.4.5 The optical band gap energies of NiPc thin films deposited atdifferent substrate temperatures.
Fig.4.4.74 Absorbance versus wavelength plot of CoPc thin filmprepared at substrate temperature 318K.
Fig.4.4.75: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 318K.
Fig.4.4.76: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 318K (trap level)
Fig.4.4.77: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 318K (trap level)
Fig.4.4.78: Absorbance versus wavelength plot of CoPc thin filmprepared at substrate temperature 363K.
Fig.4.4.79 Plot of a2 versus h for CoPc thin film prepared at substratetemperature 363K.
Fig.4.4.80: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 363K (trap level)
Fig.4.4.81: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 363K (trap level)
Fig.4.4.82: Absorbance versus wavelength plot of CoPc thin filmprepared at substrate temperature 408K.
Fig.4.4.83: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 408K.
Fig.4.4.84: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 408K (trap level)
Fig.4.4.85: Plot of a2 versus h for CoPc thin film prepared atsubstrate temperature 408K (trap level)
Fig.4.4.86: Absorbance versus wavelength plot of CoPc thin filmprepared at substrate temperature 458K.
Fig.4.4.87: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 458K.
Fig.4.4.88 Plot of a2 versus h for CoPc thin film prepared at substratetemperature 458K (trap level)
Fig.4.4.89: Plot of a2 versus h for CoPc thin film prepared at substratetemperature 458K (trap level)
Table 4.4.6 The optical band gap energies of CoPc thin films deposited atdifferent substrate temperatures
4.4.3. Dependence of air annealing
Fig. 4.4.90: Absorbance versus wavelength plot of CuPc thin filmannealed at temperature 313K.
Fig.4.4.91: Plot of a2 versus h for CuPc thin film annealed attemperature 313K
Fig.4.4.92: Plot of a2 versus h for CuPc thin film annealed attemperature 313K (trap level)
Fig.4.4.93: Plot of a2 versus h for CuPc thin film annealed attemperature 313K (trap level)
Fig.4.4.94: Absorbance versus wavelength plot of CuPc thin filmannealed at temperature 373K.
Fig.4.4.95: Plot of a2 versus h for CuPc thin film annealed attemperature 373K.
Fig.4.4.96: Plot of a2 versus h for CuPc thin film annealed attemperature 373K (trap level)
Fig.4.4.97: Plot of a2 versus h for CuPc thin film annealed attemperature 373K (trap level)
Fig.4.4.98: Absorbance versus wavelength plot of CuPc thin filmannealed at temperature 433K
Fig.4.4.99: Plot of a2 versus h for CuPc thin film annealed attemperature 433K
Fig.4.4.100: Plot of a2 versus h for CuPc thin film annealed attemperature 433K (trap level)
Fig.4.4.101: Plot of a2 versus h for CuPc thin film annealed attemperature 433K (trap level)
Table 4.4.7 The optical band gap energies of CuPc thin films annealed atdifferent temperature
Fig.4.4.102: Absorbance versus wavelength plot of NiPc thin filmannealed at temperature 313K.
Fig.4.4.103: Plot of a2 versus h for NiPc thin film annealed attemperature 313K.
Fig.4.4.104: Plot of a2 versus h for NiPc thin film annealed attemperature 313K (trap level)
Fig.4.4.105: Plot of a2 versus h for NiPc thin film annealed attemperature 313K (trap level)
Fig.4.4.106: Absorbance versus wavelength plot of NiPc thin filmannealed at temperature 353K.
Fig.4.4.107: Plot of a2 versus h for NiPc thin film annealed attemperature 353K.
Fig.4.4.108: Plot of a2 versus h for NiPc thin film annealed attemperature 353K (trap level)
Fig.4.4.109: Plot of a2 versus h for NiPc thin film annealed attemperature 353K (trap level)
Fig.4.4.110: Absorbance versus wavelength plot of NiPc thin filmannealed at temperature 393K.
Fig.4.4.111: Plot of a2 versus h for NiPc thin film annealed attemperature 393K.
Fig.4.4.112: Plot of a2 versus h for NiPc thin film annealed attemperature 393K (trap level)
Fig.4.4.113: Plot of a2 versus h for NiPc thin film annealed attemperature 393K (trap level)
Fig.4.4.114: Absorbance versus wavelength plot of CuPc thin filmannealed at temperature 433K.
Fig.4.4.115: Plot of a2 versus h for NiPc thin film annealed attemperature 433K.
Fig.4.4.116: Plot of a2 versus h for NiPc thin film annealed attemperature 433K (trap level)
Fig.4.4.117: Plot of a2 versus h for NiPc thin film annealed attemperature 433K (trap level)
Table 4.4.8: The optical band gap energies of NiPc thin films annealed atdifferent temperatures
Fig. 4.4.118: Absorbance versus wavelength plot of CoPc thin filmprepared at temperature 313K.
Fig.4.4.119: Plot of a2 versus h for CoPc thin film annealed attemperature 313K.
Fig.4.4.120: Plot of a2 versus h for CoPc thin film annealed attemperature 313K (trap level)
Fig.4.4.121: Plot of a2 versus h for CoPc thin film annealed attemperature 313K (trap level)
Fig. 4.4.122: Absorbance versus wavelength plot of CoPc thin filmannealed at temperature 353K
Fig.4.4.123: Plot of a2 versus h for CoPc thin film annealed attemperature 353K (trap level)
Fig.4.4.124: Plot of a2 versus h for CoPc thin film annealed attemperature 353K (trap level)
Fig.4.4.125: Plot of a2 versus h for CoPc thin film annealed attemperature 353K (trap level
Fig.4.4.126: Absorbance versus wavelength plot of NiPc thin filmannealed at temperature 393K.
Fig.4.4.127: Plot of a2 versus h for CoPc thin film annealed attemperature 393K.
Fig.4.4.128: Plot of a2 versus h for CoPc thin film annealed attemperature 393K (trap level)
Fig.4.4.129: Plot of a2 versus h for CoPc thin film annealed attemperature 393K (trap level)
Fig.4.4.130: Absorbance versus wavelength plot of CoPc thin filmannealed at temperature 433K.
Fig.4.4.131: Plot of a2 versus h for CoPc thin film annealed attemperature 433K.
Fig.4.4.132: Plot of a2 versus h for CoPc thin film annealed attemperature 433K (trap level)
Fig.4.4.133: Plot of
Table 4.4.9 The optical band gap energies of CoPc thin films annealed atdifferent temperature
4.5. Conclusion
References
5. STRUCTURAL STUDIES INCOPPER PHTHALOCYANINE, NICKEL PHTHALOCYANINEAND COBALT PHTHALOCYANINE THIN FILMS
5.1. Introduction
5.2. Theory
5.3. Experiment
5.4. Results and Discussion
Fig.5.4.1: X-ray diffractogram of CuPc powder.
Fig.5.4.2: X-ray diffractogram of NiPc Powder
Fig. 5.4.3: X-ray diffractogram of CoPc powder
Table 5.4.1: Standard (JCPDS) interplanar distances (hkl) withcorresponding Miller indices and 2
Table 5.4.2: Standard (JCPDS) interplanar distances (hkl) withcorresponding Miller indices and 2
Table 5.4.3. The observed interplanar distances (hkl) with corresponding2
5.4.1 Effect of substrate temperature
Fig.5.4.4: X-ray diffractogram of CuPc thin film prepared at roomtemperature303K
Fig. 5.4.5: X-ray diffractogram of CuPc thin film prepared at substratetemperature363K
Fig.5.4.6 X-ray diffractogram of CuPc thin film prepared at substratetemperature 458K
Table 5.4.4 d, 2
Table 5.4.5: Variation of FWHM of prominent peak of CuPc thin filmsdeposited at different substrate temperatures.
Fig.5.4.7: X-ray diffractogram of NiPc thin film of thickness 400nmdeposited at room temperature (303K)
Fig.5.4.8 X-ray diffractogram of NiPc thin film prepared atsubstrate temperature363K
Fig.5.4.9: X-ray diffractogram of NiPc thin film prepared at substratetemperature 458K
Table 5.4.6: Variation of FWHM of prominent peak of NiPc thin films deposited at different substrate temperatures.
Fig.5.4.10: XRD of as deposited CoPc thin film deposited at 303K.
Fig. 5.4.11: XRD of CoPc thin film deposited at 363K
Fig.5.4.12: XRD of CoPc thin film deposited at 458K
Table: 5.4.7 Variation of FWHM of prominent peak of CoPc thin filmsdeposited at different substrate temperatures.
Table 5.4.8: Variation of FWHM of preferential orientation for asdeposited CuPc, NiPc and CoPc thin films.
Table 5.4.9: Variation of FWHM of preferential orientation for CuPc, NiPc and CoPc thin films deposited at substrate temperature363K.
Table 5.4.10: Variation of FWHM of preferential orientation for CuPc, NiPc and CoPc thin films deposited of at substratetemperature 458K.
5. 5. Energy dispersive X-ray analysis (EDAX)
Fig.5.5.1: EDAX energy spectrum of vacuum evaporated CuPc thin film
Fig.5.5.2: EDAX energy spectrum of vacuum evaporated NiPc thin film
Fig.5.5.3: EDAX energy spectrum of vacuum evaporated CoPc thin film
Table: 5.5.1: EDAX quantitative results of CuPc thin film
5. 6. CONCLUSION
References
6. TOPOLOGICAL STUDIES ONCOPPER PHTHALOCYANINE, NICKEL PHTHALOCYANINEAND COBALT PHTHALOCYANINE THIN FILMS
6.1 Introduction
6.2 Theory
6.3 Experiment
6.4 Results and Discussion
6.4.1 Dependence of substrate temperature
Fig.6.1: Scanning electron micrograph of copper phthalocyanine thin film deposited at room temperature 303K (x 9000)
Fig.6.2: Scanning electron micrograph of copper phthalocyanine thin film deposited at substrate temperature 363K (x 9000)
Fig. 6.3: Scanning electron micrograph of copper phthalocyanine thin film deposited at substrate temperature 458K (x 9000)
Table 6.1: Variation of grain size with substrate temperatures for CuPcthin film
Fig.6.4: The scanning electron micrograph of NiPc thin filmdeposited at room-temperature 303K (x 9000)
Fig.6.5: The scanning electron micrograph of NiPc thin filmdeposited at substrate temperature 363K (x 9000)
Fig.6.6: The scanning electron micrograph of NiPc thin filmdeposited at substrate temperature.458K (x 9000)
Table 6.2: Variation of grain size with substrate temperatures for NiPcthin films
Fig.6.7: Scanning electron micrograph of thin film of CoPc depositedat 303K (x 9000)
Fig.6.8: Scanning electron micrograph of CoPc thin film deposited at363K (x 9000)
Fig.6.9: Scanning electron micrograph of thin film of CoPc depositedat 458K (x 9000)
Table 6.3: Variation of grain size with substrate temperatures for CoPcthin film
Table 6.4: Grain sizes for CuPc, NiPc and CoPc thin films deposited at303, 363 and 458K-substrate temperatures.
6.4. 2 Dependence of air annealing
Table 6. 5: Variation of grain size at different annealing temperatures forCuPc thin film
Fig.6.10: Scanning electron micrograph of CoPc thin film annealed at353K (x 9000)
Fig. 6.11: Scanning electron micrograph of CuPc thin film annealed at433K (x 9000)
Fig.6.12: Scanning electron micrograph of CuPc thin film annealed at433K (x 9000)
Fig.6.13: Scanning electron micrograph of CuPc thin film annealed at433K (x 1000)
Fig.6.14: Scanning electron micrograph of NiPc thin film annealed at353K (x 9000)
Fig.6.15: Scanning electron micrograph of NiPc thin film annealed at433K (x 9000)
Table 6.6 Variation of grain size at different annealing temperatures forNiPc thin films
Fig.6.16: Scanning electron micrograph of CoPc thin film annealed at353K (x 9000)
Fig.6.17: Scanning electron micrograph of CoPc thin film annealed at433K (x 9000)
Fig.6.18: Scanning electron micrograph of CoPc thin film annealed at433K (x 9000)
Fig. 6.19: Scanning electron micrograph of CoPc thin film annealed at433 K (x 500)
Table 6.7 Variation of grain size at different annealing temperatures forCoPc thin film
CONCLUSION
References
7. SUMMARY AND CONCLUSION